PAPER CORE COPPER CLAD SUBSTRATE
PAPER-BASED SUBSTRATE, COST-EFFECTIVE WITH STABLE ELECTRICAL PERFORMANCE.
PAPER CORE COPPER CLAD SUBSTRATE
Reinforced material made of bleached kraft paper, respectively impregnate in resin to make core material, covered with copper foil after high temperature and hot pressing. This type of material is generally single-sided copper clad laminate.
PRODUCT
TYPE
MODEL
FLAMMABILITY
BASE COLOR
FEATURE
XPC
CS-1150
HB
TAN
Paper based phenolic copper clad laminates / Low cost material
FR-1
CS-3151C
V0
TAN
CTI 175V / 600V WIDE APPLICATIONS , FLAMMABILITY WITH UL94V-0 GRADE
FR-1
CS-3151HS
V0
TAN
CTI 600V CTI LEVEL ABOVE 600V HIGH THERMAL AND INSULATION PROPERTIES
FR-1
CS-3152
V0
TAN
CTI 175V / 600V HALOGEN FREE
FR-2
CS-2150
V0
TAN
CTI 175V WIDE APPLICATIONS , FLAMMABILITY WITH UL94V-0 GRADE
FR-2
CS-2150G
V0
TAN
CTI 175V HALOGEN FREE
Paper core copper-clad substrate
Glass cloth copper-clad substrate
Cloth paper composite copper-clad substrate
Cloth felt composite copper-clad substrate
Paper core copper-clad substrate
Glass cloth copper-clad substrate
Cloth paper composite copper-clad substrate
Cloth felt composite copper-clad substrate
Credisyn quality copper clad laminates for global electronics
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